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Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship

University of Wisconsin, Stout - College of Tech., Engineering and Mgm

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Description

The Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship is available to sophomore packaging majors at the University of Wisconsin-Stout. You must be a resident of Wisconsin and have a minimum GPA of 3.0 to qualify for this award.

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