Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship

University of Wisconsin, Stout - College of Tech., Engineering and Mgm

amount

Varies

awards available

Unspecified

deadline

February 06, 2023

Description

The Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship is available to sophomore packaging majors at the University of Wisconsin-Stout. You must be a resident of Wisconsin and have a minimum GPA of 3.0 to qualify for this award.

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