Paul E. Kell Corrugated Packaging Scholarship
Provided by: University of Wisconsin, Stout - College of Tech., Engineering and Mgm
The Paul E. Kell Corrugated Packaging Scholarship is available to junior and senior packaging majors at the University of Wisconsin-Stout. You must be a participant in a student packaging organization and demonstrate financial need to be considered for this award. Preference is given to residents of Chippewa, Eau Claire and Dunn counties.
You Might Also Like
No Essay Required to Enter
High Value Scholarship
Exclusive Deal for Students: