Paul E. Kell Corrugated Packaging Scholarship
University of Wisconsin, Stout - College of Tech., Engineering and Mgm
University of Wisconsin, Stout - College of Tech., Engineering and Mgm
amount
Varies
awards available
Unspecified
deadline
February 05, 2024
The Paul E. Kell Corrugated Packaging Scholarship is available to junior and senior packaging majors at the University of Wisconsin-Stout. You must be a participant in a student packaging organization and demonstrate financial need to be considered for this award. Preference is given to residents of Chippewa, Eau Claire and Dunn counties.
Discover® Student Loans
Cover college costs with no fees. Apply in minutes.
Sallie Mae
$2,000 Scholarship - No Essay
Quick and Easy to Apply
$50,000 ScholarshipOwl No Essay Scholarship
Visit the provider's website to get more information and apply:
Discover® Student Loans
Cover college costs with no fees. Apply in minutes.
Sallie Mae
$2,000 Scholarship - No Essay
Quick and Easy to Apply
$50,000 ScholarshipOwl No Essay Scholarship
Copyright © 2023