Motorola/IEEE Components, Pkg. and Mfg. Technology Graduate Fellowship

Institute of Electrical and Electronics Engineers, Inc.

amount

Varies

awards available

Unspecified

deadline

Varies

Provider Scholarship Criteria

Major

Scholarship Year

Description

The Motorola/IEEE Components, Packaging and Manufacturing Technology Society Graduate Fellowship for Research on Electronic Packaging is available to graduate students pursuing a Ph.D in electronic packaging. You must have completed at least one year of graduate level coursework to be eligible for this award.

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