Kimberly-Clark Packaging Scholarship

University of Wisconsin, Stout - College of Tech., Engineering and Mgm

amount

Varies

awards available

Unspecified

deadline

Varies

Description

The Kimberly-Clark Packaging Scholarship is available to packaging majors at the University of Wisconsin-Stout. You must be a member of the Institute of Packaging Professionals, have a minimum 2.8 GPA, and demonstrate community service to be eligible for this award.

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