Integrated Circuits Packaging Internship

Description

The Integrated Circuits Packaging Internship is available to students pursuing a BS, MS, or PhD degree in mechanical engineering, engineering mechanics, materials science, physics or related fields. You must have hands-on experience of major mechanical design CAD tools, such as NX, AutoCAD, SpaceClaim, SolidWorks, etc. and excellent written and verbal communication skills. Able to present ideas, data and plans with high confidence at team meetings to considered for this position. As an intern, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple’s customers every single day.