Modem DSP Firmware Engineer Intern

Description

The Modem DSP Firmware Engineer Intern is available to students with Master/PhD in electrical engineering, wireless communications or equivalent majors. You must have strong theoretical background in digital signal processing and wireless communications is required, and experience with Physical layer algorithm design and done simulation development in wireless systems such as LTE/5G, UMTS and WiFi/BT, and have a keen vision and awareness of new technologies, applications and use cases to be considered for this position. As an intern, you will work on wireless physical layer research and development, wireless systems design.