Kimberly-Clark Packaging Scholarship

Provided by: University of Wisconsin, Stout - College of Tech., Engineering and Mgm

Awards

Varies

Deadline

Varies

The Kimberly-Clark Packaging Scholarship is available to packaging majors at the University of Wisconsin-Stout. You must be a member of the Institute of Packaging Professionals, have a minimum 2.8 GPA, and demonstrate community service to be eligible for this award.