Paul E. Kell Corrugated Packaging Scholarship
Provided by: University of Wisconsin, Stout - College of Tech., Engineering and Mgm
The Paul E. Kell Corrugated Packaging Scholarship is available to junior and senior packaging majors at the University of Wisconsin-Stout. You must be a participant in a student packaging organization and demonstrate financial need to be considered for this award. Preference is given to residents of Chippewa, Eau Claire and Dunn counties.