Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship
University of Wisconsin, Stout - College of Tech., Engineering and Mgm
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Description
The Wisconsin Institute of Packaging Professionals (IOPP) Chapter Scholarship is available to sophomore packaging majors at the University of Wisconsin-Stout. You must be a resident of Wisconsin and have a minimum GPA of 3.0 to qualify for this award.
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